FLEX
CIRCUITS
Multi-layer Flex
Minco’s multi-layer flex technology provides the ability to stack layers in applications where wire bundles might take up too much space. In multi-layer flex solutions, three or more flex layers are used to accommodate more routed signals without increasing footprint size.
Integration-Ready Features
- Multi-layer solutions can incorporate multiple conductive layers of varying copper thickness
- Layer counts are scalable to meet the needs of the application
- Flexible features can accommodate EMI shielding layers and through-hole assembly
- Unbonded areas can increase circuit flexibility
Ready to initiate a project?
Use this new flex project worksheet to get started.
