FLEX
CIRCUITS
Our Technology Road Map
When you engage Minco early in the design cycle, our team of highly trained engineers can introduce design insights that help reduce risk, minimize cost and increase solution reliability. Our proprietary New Product Introduction (NPI) approach allows for upfront design and manufacture analysis, followed by a process risk analysis step to promote fewer product iterations and minimize delays.
Time-Tested Processes Speed Timelines and Protect Quality
- Production processes are validated using DOE methodology to reduce quality variance
- Active supply chain management address demand fluctuations and cost objectives
- Lean principles streamline the design and manufacturing processes
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| Description | Rigid Flex |
Multilayer, Dbl Layer & Single Layer |
HDI |
| Min. drilled via finished dia. | .008" | .008" | n/a |
| Min. laser via formed dia. | .003 | .003" | 75μm |
| Min. line and spacing | .003"/.003" |
.003"/.003" | 50μm /50μm |
| Min. copper thickness |
9 Micron |
9 Micron |
9 Micron |
| Max copper thickness |
< 2 oz |
< 4oz | < 1oz |
| Min. pad size for thru-hole vias |
Via dia. + .015" |
Via dia. + .015" |
n/a |
| Min. pad size for micro vias |
N/A | Via dia. + .006 |
Via dia. + .006 |
| Panel Size |
18" by 24" |
18" by 24" |
18" by 24" |
| Thru hole plating aspect ratio |
10:1 | 10:1 | 4:1 |
| Blind micro via min. plating aspect ratio |
- | 1:1 | 1:1 |
| Panel plating |
yes | yes |
yes |
| Selective plating |
yes | yes |
yes |
| Number of layers |
12+ | 1-10 | 2-6 |
| Via fill |
Copper filled |
Copper filled |
Copper filled |
Ready to initiate a project?
Use this new flex project worksheet to get started.
