FLEX
CIRCUITS
HIGH DENSITY INTERCONNECT
Running out of real estate with conventional feature sizes? Minco High Density Interconnect (HDI) flex circuits can improve electrical performance and consistency by using vias as small as 50 microns or 9-micron copper to increase density in a small electronic package.
Integration-Ready Features
- Decreased package size allows for a smaller overall footprint
- Blind and buried via constructions introduce additional design options
Ready to initiate a project?
Use this new flex project worksheet to get started.
